EBS Electric specialist operating an electronic production line

Behind every delivered product lies a complete technological infrastructure — from component placement and nitrogen soldering, to battery pack assembly and cable processing — and an experienced team operating it.

For startups and product development

Fully equipped production lines enabling prototypes and small series with low entry costs — amortized together as production scales with us. High-precision automated placement, stations for special components, and flexible test equipment: the same technology that validates the first prototype is also used to scale it into volume production.

For OEMs and serial production

Fully equipped SMT and THT lines, wire bonding technology for battery packs, and high-performance cable processing equipment — all with automated traceability. Industrial-scale capacity and repeatability, ensuring consistent quality at volume production standards.

Assembly Technology

PCBA Production Flow

SMD Placement & Soldering

01Production preparation
02Stencil printing / solder paste application
03SPI — solder paste inspection
04SMD component placement (pick & place)
05Reflow soldering

Inspection & THT

063D automated optical inspection (AOI)
07THT component placement
08Selective soldering in nitrogen atmosphere

Finalization

09Functional testing
10ESD packaging for delivery

screen printing

SMD placement

AOI 3D

THT soldering

selective soldering

functional testing

Asamblare & testare battery pack (wire bonding)

We perform ultrasonic wire bonding using wire as thin as 50 µm, enabling assembly of cylindrical cells from 18650 up to 40135 formats. For each cell, we weld between 1 and 5 wires, sized to ensure the required current for series and parallel connections. Force and energy monitoring for every weld guarantees highly reliable connections. Dedicated production line and testing.

Cable processing & crimping

CNC cutting and stripping for conductors from 0.5 mm² to 10 mm² (approximately AWG 20 to AWG 7), without damaging stranded wires. We crimp terminals and contacts using applicators sourced in compliance with manufacturer specifications—ensuring crimp conformity with both customer requirements and terminal manufacturer standards. Crimping is monitored in real time using force–displacement curves (Molex, TE, Amphenol).

Technical capabilities

PCB Materials

Rigid (FR-4), aluminum (Al), flexible, rigid-flex

Number of layers

Up to 24

Board thickness

Up to 4 mm

Board dimensions

from 5.08 × 5.08 mm up to 400 × 460 mm

Board geometry

Rectangular, round, or with complex milling and cut-outs

Minimum component size

0201

Special technologies

Fine-pitch down to 5 mil, BGA, QFN, complex connectors and terminals

Component formats

Tape & Reel, Tube, Tray

Testing

ICT and functional testing, with in-house developed software applications

Selective coating

99% transfer efficiency

Work standard

IPC-A-610, Class 2

Start your project with us

Tell us what you need — from an idea to a production-ready product. We’ll respond with a concrete solution.