Zero defects through technological rigor and continuous monitoring.
Our Design for Test (DFT) strategy ensures that any error is detected and corrected in the early stages, significantly reducing production costs and the risk of product returns.
We perform a digital scan immediately after assembly to ensure the integrity of every solder joint:
Defect detection: We identify missing components, incorrect placement, fine-pitch pin short circuits, and solder volume issues.
OCR technology: We automatically recognize component part codes to ensure that no component has been reversed, which is critical in extreme miniaturization cases.
We provide customized testing solutions tailored to the specific needs of your laboratory:
Test Fixtures (Bed of Nails): We design and manufacture custom test adapters for each type of PCB.
Control Software: We develop proprietary applications for test systems (rack & stack), offering consulting in the initial phases to ensure product testability.
Final Assembly and Box-Build: We integrate production with final testing and packaging. We can deliver the product fully assembled in its enclosure, functionally tested, and ready for direct shipment to the end customer, allowing you to focus on sales.